1) Si2 uses Auth0 for user authentication. Recently, Auth0 implemented necessary heightened security for 1) leaked passwords and 2) brute-force login attempts.
IF YOU GET AN ERROR ON LOGIN ( Note: AT TOP of Login Form ) ---- AND SEE one of these POSSIBLE error messages:
Possible Error Message: password-leak. This error indicates that a password, used by the same user-name or user email-address, was leaked from a different site. IF you get this error!! You must change your Si2 password.
Possible Error Message: too_many_attemps. TEN consecutive, unsuccessful, login attemps will cause a block on an account.
IF you get this error!! YOU MUST CONTACT Si2 to UNBLOCK your account at Auth0.
2) NEW SIGNED LICENSE Will Be NEEDED: Si2 OpenAccess Extension Downloads, like oaScript and oaxPop, currently require the signed OpenAccess ESG License v 2.0 January 31, 2013. This license is being replaced SOON by the
OpenAccess ESG License V2.0.1 (March 15, 2017).
Your company should download, sign, and submit OpenAccess ESG License V2.0.1 (March 15, 2017). See See License Information Here!
for Manufacturability Coalition Workshop Date:
Sunday, June 13
Meeting room: 207C
Free Admission, Register at DAC Website
The workshop will educate the
audience on a high level DFM verification and optimization language
called OpenDFM. OpenDFM rules bridge the gap between a layout style
that allows only a few, very restricted layout patterns and a style
that allows purely arbitrary layouts. OpenDFM functions transform
database shapes, regardless of their origin and design style, into the
on-silicon target shapes that design and manufacturing both agree are
the reference shapes for silicon based measurements and extraction.
OpenDFM increases the level of pattern uniformity in the layout and it
polishes the rough spots in the layout when it finds layout patterns
that are known to be problematic. OpenDFM modifies the design to
physically optimize and measurably affect electrical performance to
enhance Process Limited Yield (PLY) and/or Circuit Limited Yield (CLY)
during the design process and not at post tapeout.
This workshop is not intended to continue to admire the problems of
Design for Manufacturing for SoC design but to show that real progress
is being made. As part of the workshop, selected vendors will present
their products aimed at helping designers produce higher yielding
integrated circuits and systems.