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CPC (Open3D) TAB Specifications

 

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TimeTypeArchSize

3D-IC Design Exchange Format Standard for PDNMonitor this package

   Chip-Package Interface Protocol V1.0    (Readme Notes) 2013-05-30 09:29
  Identified_Patents.pdf     (Lic ?)2013-05-30 11:02:47DocumentationOther26312
  Si2_Chip_Package_Interface_Protocol_document_V1.0_05-30-2013.pdf     (Lic ?)2013-05-30 09:31:07SpecificationOther762448

3D-IC Design Exchange Format Standard for Thermal ManagementMonitor this package

   Chip Thermal Interface Protocol V1.0    (Readme Notes) 2014-04-01 16:16
  Si2_3D-IC_Chip_Thermal_Interface_Protocol_Document_v1.0_2013-11-16.pdf     (Lic ?)2014-04-01 16:18:20Specificationmulti-platform1380026

3D-IC Design Exchange Format Standard for PathFindingMonitor this package

   PathFinding Interface Protocol V1.0    (Readme Notes) 2015-02-04 13:25
  Si2_3DIC_Design_Exchange_Format_Pathfinding_v1.0_2015-02-04.pdf     (Lic ?)2015-02-04 13:29:50Documentationmulti-platform389824



 
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