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3D Standards Workshop
Si2-GSA Workshop on Requirements for 3D Design Flow Interoperability Standards
   (Click on company name to see the presentation)

The Si2-GSA 3D Standards Workshop was held at the Santa Clara Convention Center on 10/1/2009. There were almost 50 attendees representing all stakeholders from the semiconductor industry, as well as members from academia and other standards organizations. The workshop attendees heard presentations from all the stakeholders and collected a treasure trove of information and requirements for standards that are being compiled and assimilated at the present time. The important message drawn from this workshop is that modeling of through-silicon-vias (TSV's) is a significant challenge and that 3D design will not only require   significant enhancements to existing   design flows and tools for 2D design but will require new methods for design  exploration and implementation across a third dimension as well as methods to access analysis tools for mechanical and thermal stress. The formal presentations are available from websites of Si2 and GSA while the requirements gathered at the workshop will form the basis for future work on standards development activities at Si2 and other partner organizations.



 






             Organizations                    Speakers




Si2
Sumit DasGupta



GSA
Herb Reiter



IMEC
Pol Marchal



SPIRIT 
Gary Delp 



SEMI
Paul Trio




IBM 
Patrick Williams



Qualcomm
Riko Radojcic



ST Micro
Indavong Vongasavady



SUN
Bidyut Sen



Xilinx
Arif Rahman



NC State
Rhett Davis



PRC/GaTech
Madhavan Swaminathan



Atrenta
Ravi Varadarajan



Cadence
Vassilios Gerousis



Gradient
Ed Cheng



Magma
Patrick Groeneveld



Mentor Graphics
Dusan Petranovic



R3 Logic
Lisa McIlrath



Synopsys
Rajiv Maheshwary
 
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